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Qualcomm® Robotics RB3 Development Plat<strong>f</strong>orm - 96Boards

The Robotics DragonBoard™ 845c development board is based on the Qualcomm® SDA845 processor.

The Qualcomm SDA845 processor is a heterogeneous computing architecture and integrates an Octa Core Qualcomm® Kryo™ CPU with performance up to 2.8GHz a Qualcomm® Adreno™ 630 Visual Processing Subsystem (including GPU, VPU and DPU), and a Qualcomm® Hexagon™ 685 DSP with Hexagon Vector Extensions (HVX) delivering sophisticated, on-device AI processing and mobile-optimized computer vision (CV) capabilities for perception, navigation and manipulation.

The development board supports Linux and Robotics Operating System (ROS), while also including support for the Qualcomm® Neural Processing software development kit (SDK) for advanced on-device AI, the Qualcomm® Computer Vision Suite, the Qualcomm® Hexagon DSP SDK, and AWS RoboMaker.

The development board supports new architecture for AI, 4K@60fps H.264/H.265 Encode & Decode, rich interfaces, and many I/O expansion headers. It is an ideal platform for developers to quickly start the product development work.

Note: DragonBoard 845c is ONLY available in the Qualcomm® Robotics RB3 Development Kit.


Additional Information

Component Description
SoC Qualcomm SDA845
CPU Qualcomm SDA845 embedded platform, custom 64-bit ARM v8-compliant octa-core CPU Up to 2.8 GHz,10nm LPP finfET process technology
GPU Adreno™ 630 GPU
OpenGL™ ES 3.2 + AEP, DX next, Vulkan®2,
OpenCL™ 2.0 full profile, RenderScript
DSP Hexagon™ 685 DSP
RAM 4GB LPDDR4x SDRAM @ 1866 MHz
Storage 64GB UfS 2.1 on-boardstorage and1 x MicroSD card slot
Ethernet Port 1x GbE Ethernet
Wireless WLAN 802.11a/b/g/n/ac 2.4/5GHz 2×2 MIMO & Bluetooth ® wireless technology 5.0,on-boardWLAN/BT/GPSantennas
USB 1 x USB 2.0 Micro B (Debug only ),
1 x USB 3.0 Type C (OTGmode),
2x USB 3.0 Type A (Host mode only)
Display Two 4-lane DSI, D-PHY 1.2 or C-PHY 1.0; VESA DSC 1.1
1 x HDMI 1.4 (Type A -full) connector
Video 4K60 decode for H.264 High Profile, H.265 Main 10 Profile and VP9 Profile 2,
4K60 encode for H.264 High Profile, H.265 Main 10 Profile
Audio MP3; aacPlus, eAAC; WMA 9/Pro
Camera Qualcomm Spectra™ 280 ISP, dual 14-bit ISP+one Lite ISP, 32 MP 30 fps ZSL with a dual ISP
Sensors Accelerometer + Gyro Sensor/ Proximity sensor
Expansion Interface HS1:1 x 60 pin High-Speed connector (4L-MIPI DSI, USB 2.0 x2,I2C x2, 2L+4L-MIPI CSI)
HS2:1x 60 pin High-Speed connector (4L-MIPI CSI x 2, SSC SPI, PCIe 3.0,USB 3.0 x1, GPIO x 9)
LS1:1x 96boards 40 pin Low-Speed connector (UART x2, SPI, I2S, I2C x2, GPIO x12, DC power)
LS2:1x 96boards 40 pin Low-Speed connector(headset, stereospeaker, DMIC I/f x3, CAN, I2S, GPIO x 7, PWM x 2, ADC x 2)
LS3:1x 96boards 20 pin Low-Speed connector (SSC SPI x 3, SSC I2C, sensor interrupt x 5)
LED 7 LED indicators:
4 - user controllable
2 - for radios (BT and WLAN activity)
1 - power indicator
Button Power ,Volume Up/Down,force Usb Boot, DipSwitch(6 PIN)
Power Source 12V@2.5A adapter with a DC plug:
Plug specification is inner diameter 1.75mm and outer diameter 4.75mm
OS Support Thundersoft LE, Linaro Linux builds with Debian or OpenEmbedded / Yocto Project, AOSP
Size 85mm by 54 mm meeting 96Boards™ Consumer Edition Standard form dimensions specifications